The new high-efficiency Lunar Lake CPUs have already appeared online, here are the features

Intel is preparing to launch its new line Lunar Lake MX of high efficiency chips designed for non-gaming laptops but which can guarantee an autonomy high (do you know how to overclock the CPU?).

The preview was published on X and then removed from leaker @YuuKi_AnSbut the saved images have already made the rounds on the Web, causing quite a stir.

As revealed, the new CPU they will have GPU And RAM integrated, just like chips M series of Apple, with powers between 8W And 30W. This is therefore an architecture designed to replace the series Meteor Lake-U (not yet released) and certainly not the Meteor Lake-H.

The chip, developed together with Microsoft to optimize software/hardware integration, it offers up to eight cores: four efficiency core Skymont and four core performance Lion Cove. There cache it reaches 12 MB, and we have a on board NPU 4.0 (Neural Processing Unit) integrated next generation supported by a GPU Xe2-LPG up to eight cores (an evolution of the Arc series designed).

The Lunar Lake MX GPU will feature support for several display interfaces, including DisplayPort 1.4 And HDMI 2.1and is also expected to have video decoding VVC/H.266 hardware based.

In terms of memory, there will be two options: from 16 GB And 32GBand Intel has at least one in mind four variations with different CPU and GPU core configurations:

• Core 7 32GB: 4P + 4E + 8 Xe2-LPG
• Core 7 16GB: 4P + 4E + 8 Xe2-LPG
• Core 5 32GB: 4P + 4E + 7 Xe2-LPG
• Core 5 16GB: 4P + 4E + 7 Xe2-LPG

The architecture supports on-package memory LPDDR5X-8533 dual channel, a solution that allows you to save money power and reduce the dimensions.

Interestingly, from the leaked information it appears that version a 8W it will be fanless, while the variants with TDP will 17 to 30W they will be equipped with a fan. From a performance perspective, the 12W version of the Arc Xe2-LPG GPU could deliver 2.5 TFLOPS single precision, equivalent to the Apple M1 chip, with peak Arc performance up to 3.8 TFLOPS, which is below the Apple M2 chip.

The series Lunar Lake MX it will support PCIe Gen5x4 and Gen4x4 interface with Thunderbolt 4 and up to three USB4 connectors, and in terms of connectivity there is support for connections Wi-Fi-7 And Bluetooth 5.4 via the BE201 network card based on the CNVio3 interface.

From leaked information, the new Lunar Lake series, produced using TSMC’s 3nm N3B process, is expected to launch later this year. 2024.